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Chiplet Design and Heterogeneous Integration Packaging John H. Lau 2023 edition
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Chiplet Design and Heterogeneous Integration Packaging
John H. Lau
525 pages, 501 Illustrations, color; 42 Illustrations, black and white; XXII, 525 p. 543 illus., 501
| Mídia | Livros Paperback Book (Livro de capa flexível e brochura) |
| Lançado | 29 de março de 2024 |
| ISBN13 | 9789811999192 |
| Editoras | Springer Verlag, Singapore |
| Páginas | 525 |
| Dimensões | 150 × 220 × 10 mm · 920 g |
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