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Fan-Out Wafer-Level Packaging John H. Lau Softcover Reprint of the Original 1st 2018 edition
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Fan-Out Wafer-Level Packaging
John H. Lau
This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging.
303 pages, 150 Tables, color; 226 Illustrations, color; 52 Illustrations, black and white; XX, 303 p
| Mídia | Livros Paperback Book (Livro de capa flexível e brochura) |
| Lançado | 16 de dezembro de 2018 |
| ISBN13 | 9789811342660 |
| Editoras | Springer Verlag, Singapore |
| Páginas | 303 |
| Dimensões | 150 × 220 × 10 mm · 493 g |
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