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Assembly and Reliability of Lead-Free Solder Joints John H. Lau 2020 edition
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Assembly and Reliability of Lead-Free Solder Joints
John H. Lau
527 pages, 250 Tables, color; 347 Illustrations, color; 251 Illustrations, black and white; XXI, 527
| Mídia | Livros Paperback Book (Livro de capa flexível e brochura) |
| Lançado | 30 de maio de 2021 |
| ISBN13 | 9789811539220 |
| Editoras | Springer Verlag, Singapore |
| Páginas | 527 |
| Dimensões | 156 × 233 × 28 mm · 908 g |
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