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Chiplet Design and Heterogeneous Integration Packaging John H. Lau 2023 edition
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Chiplet Design and Heterogeneous Integration Packaging
John H. Lau
525 pages, 501 Illustrations, color; 42 Illustrations, black and white; XXII, 525 p. 543 illus., 501
| Mídia | Livros Hardcover Book (Livro com lombada e capa dura) |
| Lançado | 28 de março de 2023 |
| ISBN13 | 9789811999161 |
| Editoras | Springer Verlag, Singapore |
| Páginas | 525 |
| Dimensões | 242 × 162 × 33 mm · 1,07 kg |
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