Conte aos seus amigos sobre este item:
Solder Joint Reliability: Theory and Applications John H. Lau Softcover reprint of the original 1st ed. 1991 edition
Solder Joint Reliability: Theory and Applications
John H. Lau
New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them.
652 pages, 146 black & white illustrations, biography
| Mídia | Livros Paperback Book (Livro de capa flexível e brochura) |
| Lançado | 23 de fevereiro de 2014 |
| ISBN13 | 9781461367437 |
| Editoras | Springer-Verlag New York Inc. |
| Páginas | 631 |
| Dimensões | 155 × 235 × 34 mm · 902 g |
| Idioma | Inglês |