Conte aos seus amigos sobre este item:
Fan-Out Wafer-Level Packaging John H. Lau 2018 edition
Preço
R$ 825,90
excluindo impostos
Item sob encomenda (no estoque do fornecedor)
Espera-se estar pronto para envio 30 de set - 6 de out
Receba avisos sobre novos lançamentos de John H. Lau
O que dizem nossos clientes:
Adicione à sua lista de desejos do iMusic
Também disponível como:
Fan-Out Wafer-Level Packaging
John H. Lau
This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging.
303 pages, 150 Tables, color; 226 Illustrations, color; 52 Illustrations, black and white; XX, 303 p
| Mídia | Livros Hardcover Book (Livro com lombada e capa dura) |
| Lançado | 13 de abril de 2018 |
| ISBN13 | 9789811088834 |
| Editoras | Springer Verlag, Singapore |
| Páginas | 303 |
| Dimensões | 170 × 241 × 27 mm · 660 g |
![Cover for John H. Lau · Chiplet Design and Heterogeneous Integration Packaging (Hardcover Book) [2023 edition] (2023)](https://imusic.b-cdn.net/images/item/original/161/9789811999161.jpg?john-h-lau-2023-chiplet-design-and-heterogeneous-integration-packaging-hardcover-book&class=scaled&v=1695532633)
![Cover for John H. Lau · Semiconductor Advanced Packaging (Hardcover Book) [2021 edition] (2021)](https://imusic.b-cdn.net/images/item/original/753/9789811613753.jpg?john-h-lau-2021-semiconductor-advanced-packaging-hardcover-book&class=scaled&v=1623687781)
![Cover for John H. Lau · Assembly and Reliability of Lead-Free Solder Joints (Hardcover Book) [2020 edition] (2020)](https://imusic.b-cdn.net/images/item/original/190/9789811539190.jpg?john-h-lau-2020-assembly-and-reliability-of-lead-free-solder-joints-hardcover-book&class=scaled&v=1588376991)
![Cover for John H. Lau · Heterogeneous Integrations (Hardcover Book) [2019 edition] (2019)](https://imusic.b-cdn.net/images/item/original/230/9789811372230.jpg?john-h-lau-2019-heterogeneous-integrations-hardcover-book&class=scaled&v=1588376885)
![Cover for John H. Lau · Handbook Of Tape Automated Bonding (Hardcover Book) [1992 edition] (1992)](https://imusic.b-cdn.net/images/item/original/279/9780442004279.jpg?john-h-lau-1992-handbook-of-tape-automated-bonding-hardcover-book&class=scaled&v=1570666783)
![Cover for John H. Lau · Solder Joint Reliability: Theory and Applications (Hardcover Book) [1991 edition] (1991)](https://imusic.b-cdn.net/images/item/original/602/9780442002602.jpg?john-h-lau-1991-solder-joint-reliability-theory-and-applications-hardcover-book&class=scaled&v=1516985150)
![Cover for Glycoconjugates of the Pancreas (Hardcover Book) [2024 edition] (2027)](https://imusic.b-cdn.net/images/item/original/669/9789819947669.jpg?2027-glycoconjugates-of-the-pancreas-hardcover-book&class=scaled&v=1774521203)
![Cover for Yu Hui · Traditional Chinese Music Research: An Insider's Exploration (Hardcover Book) [2024 edition] (2027)](https://imusic.b-cdn.net/images/item/original/931/9789819763931.jpg?yu-hui-2027-traditional-chinese-music-research-an-insider-s-exploration-hardcover-book&class=scaled&v=1774341101)
![Cover for D. S. Ramana · Arithmetical Aspects of the Large Sieve Inequality - Texts and Readings in Mathematics (Hardcover Book) [Second Edition 2026 edition] (2027)](https://imusic.b-cdn.net/images/item/original/189/9789819247189.jpg?d-s-ramana-2027-arithmetical-aspects-of-the-large-sieve-inequality-texts-and-readings-in-mathematics-hardcover-book&class=scaled&v=1788248108)
![Cover for Ram Kumar Mishra · Government Performance Management: Experiences and Lessons for India - SpringerBriefs in Business (Paperback Book) [2022 edition] (2026)](https://imusic.b-cdn.net/images/item/original/647/9789811613647.jpg?ram-kumar-mishra-2026-government-performance-management-experiences-and-lessons-for-india-springerbriefs-in-business-paperback-book&class=scaled&v=1694194972)
