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Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology John H. Lau
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Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
John H. Lau
501 pages, 520 Illustrations, color; 36 Illustrations, black and white; XX, 501 p. 556 illus., 520 i
| Mídia | Livros Hardcover Book (Livro com lombada e capa dura) |
| Lançado | 24 de maio de 2024 |
| ISBN13 | 9789819721399 |
| Editoras | Springer Verlag, Singapore |
| Páginas | 501 |
| Dimensões | 150 × 220 × 20 mm · 1,03 kg |
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