Conte aos seus amigos sobre este item:
Through-Silicon Vias for 3D Integration John Lau Ed edition
Through-Silicon Vias for 3D Integration
John Lau
This professional book focuses on the latest cost- and space-saving methods of 3D integrated circuits—essential for the development of low-cost, high-performance electronic and optoelectronic products.
512 pages, ill
| Mídia | Livros Hardcover Book (Livro com lombada e capa dura) |
| Lançado | 16 de dezembro de 2012 |
| ISBN13 | 9780071785143 |
| Editoras | McGraw-Hill Education - Europe |
| Páginas | 512 |
| Dimensões | 160 × 231 × 21 mm · 722 g |