Conte aos seus amigos sobre este item:
Arbitrary Modeling of TSVs for 3D Integrated Circuits - Analog Circuits and Signal Processing Khaled Salah Softcover reprint of the original 1st ed. 2015 edition
Arbitrary Modeling of TSVs for 3D Integrated Circuits - Analog Circuits and Signal Processing
Khaled Salah
This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits.
188 pages, 60 black & white illustrations, 99 colour illustrations, 58 black & white tables, 5 colou
| Mídia | Livros Paperback Book (Livro de capa flexível e brochura) |
| Lançado | 23 de agosto de 2016 |
| ISBN13 | 9783319374970 |
| Editoras | Springer International Publishing AG |
| Páginas | 179 |
| Dimensões | 155 × 235 × 10 mm · 276 g |
| Idioma | Alemão |