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Design and Modeling for 3D Ics and Interposers - Wspc Series in Advanced Integration and Packaging Swaminathan, Madhavan (Georgia Institute of Technology, USA)
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Design and Modeling for 3D Ics and Interposers - Wspc Series in Advanced Integration and Packaging
Swaminathan, Madhavan (Georgia Institute of Technology, USA)
380 pages
| Mídia | Livros Hardcover Book (Livro com lombada e capa dura) |
| Lançado | 24 de dezembro de 2013 |
| ISBN13 | 9789814508599 |
| Editoras | World Scientific Publishing Co Pte Ltd |
| Páginas | 380 |
| Dimensões | 236 × 156 × 26 mm · 672 g |
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