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Electromigration in Ulsi Interconnections - International Series on Advances in Solid State Electronics and Technology Tan, Cher Ming (Nanyang Technological University, Singapore)
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Electromigration in Ulsi Interconnections - International Series on Advances in Solid State Electronics and Technology
Tan, Cher Ming (Nanyang Technological University, Singapore)
Presents a description of the electro migration in integrated circuits. This book examines the various interconnected systems and their evolution employed in integrated circuit technology. It is suitable for readers on electro migration in ULSI interconnections.
312 pages, illustrations
| Mídia | Livros Hardcover Book (Livro com lombada e capa dura) |
| Lançado | 25 de agosto de 2010 |
| ISBN13 | 9789814273329 |
| Editoras | World Scientific Publishing Co Pte Ltd |
| Páginas | 312 |
| Dimensões | 155 × 229 × 23 mm · 589 g |
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