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Embedded Cooling of Electronic Devices: Conduction, Evaporation, and Single- and Two-phase Convection - Wspc Series in Advanced Integration and Packaging Madhusudan Iyengar
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Embedded Cooling of Electronic Devices: Conduction, Evaporation, and Single- and Two-phase Convection - Wspc Series in Advanced Integration and Packaging
Madhusudan Iyengar
| Mídia | Livros Hardcover Book (Livro com lombada e capa dura) |
| Lançado | 16 de fevereiro de 2024 |
| ISBN13 | 9789811277931 |
| Editoras | World Scientific Publishing Co Pte Ltd |
| Páginas | 480 |
| Dimensões | 150 × 220 × 20 mm · 840 g |
| Editor | Asheghi, Mehdi (Stanford University, USA) |
| Editor | Iyengar, Madhusudan (Google Plaforms, USA) |
| Editor | Weibel, Justin A (Purdue University, USA) |
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