Conte aos seus amigos sobre este item:
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method - Springer Series in Advanced Manufacturing Seonho Seok Softcover Reprint of the Original 1st 2018 edition
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method - Springer Series in Advanced Manufacturing
Seonho Seok
| Mídia | Livros Paperback Book (Livro de capa flexível e brochura) |
| Lançado | 5 de janeiro de 2019 |
| ISBN13 | 9783030085612 |
| Editoras | Springer Nature Switzerland AG |
| Páginas | 115 |
| Dimensões | 150 × 220 × 10 mm · 185 g |
| Idioma | Alemão |