Conte aos seus amigos sobre este item:
Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging - Materials, Circuits and Devices Zhang, Shuye (Associate Professor, Harbin Institute of Technology, China)
Preço
R$ 692,90
excluindo impostos
Item sob encomenda (no estoque do fornecedor)
Espera-se estar pronto para envio 24 de set - 6 de out
Receba avisos sobre novos lançamentos de Zhang, Shuye (Associate Professor, Harbin Institute of Technology, China)
O que dizem nossos clientes:
Adicione à sua lista de desejos do iMusic
Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging - Materials, Circuits and Devices
Zhang, Shuye (Associate Professor, Harbin Institute of Technology, China)
There is a growing demand for more accurate simulation techniques to address the thermomechanical challenges faced in advanced electronic packaging. This book compiles the latest advancements in thermomechanical simulation methodologies, empowering readers with the knowledge to help optimize electronic package designs.
| Mídia | Livros Hardcover Book (Livro com lombada e capa dura) |
| Lançado | 1 de julho de 2025 |
| ISBN13 | 9781837241408 |
| Editoras | Institution of Engineering and Technolog |
| Páginas | 199 |
| Dimensões | 150 × 220 × 20 mm · 462 g |
