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Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments - Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems Juan Cepeda-Rizo 2º edição
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Data prevista de entrega 4 - 6 de jan de 2027
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Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments - Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems
Juan Cepeda-Rizo
Suitable for practicing professionals as well as upper-level students in the areas of aerospace, mechanical, thermal, electrical, and systems engineering, Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments has cutting-edge information on how to design, analyze, and test in the small satellite environment.
| Mídia | Livros Hardcover Book (Livro com lombada e capa dura) |
| A ser lançado | 24 de dezembro de 2026 |
| ISBN13 | 9781041216919 |
| Editoras | Taylor & Francis Ltd |
| Páginas | 304 |
| Dimensões | 150 × 220 × 20 mm · 490 g (Peso (estimado)) |
