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SemiConductor Wafer Bonding: Science and Technology - The ECS Series of Texts and Monographs Tong, Q.-Y. (Duke University, Durham, North Carolina, Max-Planck-Institute of Microstructure Physics, Halle, Germany, Southeast University, Nanjing, China)
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SemiConductor Wafer Bonding: Science and Technology - The ECS Series of Texts and Monographs
Tong, Q.-Y. (Duke University, Durham, North Carolina, Max-Planck-Institute of Microstructure Physics, Halle, Germany, Southeast University, Nanjing, China)
Though there has been a lot of scattered information on specific aspects of wafer bonding--a technique for welding semiconductor wafers together without using glue, this is one of the first practical works to bring together a broad range of information into a coherent overview of the field.
320 pages, illustrations
| Mídia | Livros Hardcover Book (Livro com lombada e capa dura) |
| Lançado | 23 de novembro de 1998 |
| ISBN13 | 9780471574811 |
| Editoras | John Wiley & Sons Inc |
| Páginas | 320 |
| Dimensões | 164 × 246 × 20 mm · 566 g |
| Idioma | Inglês |
