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Electromigration in Thin Films and Electronic Devices: Materials and Reliability - Woodhead Publishing Series in Electronic and Optical Materials Choong-Un Kim
Electromigration in Thin Films and Electronic Devices: Materials and Reliability - Woodhead Publishing Series in Electronic and Optical Materials
Choong-Un Kim
352 pages
| Mídia | Livros Paperback Book (Livro de capa flexível e brochura) |
| Lançado | 11 de setembro de 2011 |
| Data do lançamento original | 2016 |
| ISBN13 | 9780081016961 |
| Editoras | Elsevier Science & Technology |
| Páginas | 352 |
| Dimensões | 150 × 220 × 10 mm · 494 g |
| Editor | Kim, Choong-Un (University of Texas at Arlington, USA) |